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Trenz Electronic
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)

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Trenz Electronic GmbH

BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)

High Performance maxiFLOW/superGRIP Heat Sink BGA Aluminum, Top Mount

Item number VAR-827001460

Manufacturer Product Number: ATS-X50170P-C1-R0

Taric/custom code: 84715000

Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }

Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 15 euros.

Item located in and dispatched from: Riedlingen, Germany

EUR 32.00 ^*

Content 1 piece

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* Excl. VAT excl. Shipping

Item ID	101238
Condition	New
Legacy item ID	3432
Model	ATS-X50170P-C1-R0
Manufacturer	Trenz Electronic GmbH
Manufacturing country	Germany
Content	1 piece
Weight	800 g
Net weight	800 g
Customs tariff number	84715000

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Alinx
345

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6

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Teltonika
256

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Digilent
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Trenz Electronic
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AMD (Xilinx)
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SystemBase
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Use cases
18

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5

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Discontinued items
80

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