Trenz Electronic GmbH

UltraSOM+ MPSoC Module with AMD Zynq UltraScale+ ZU9EG-2I, 4 GByte DDR4 (TE0808-05-9GI81-E)

AMD Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GByte DDR4 SDRAM, 128 MByte SPI Boot Flash, 20 x serial high-speed transceiver, size: 5,2 x 7,6 cm


Numero di variazione (MEPA): VAR-827003116

Codice produttore: TE0808-05-9GI81-E

Codice doganale:


Disponibile per la spedizione immediata: 0

Tempo di elaborazione 3 giorni. Per gli ordini con un valore netto totale inferiore a 70 euro, verrà applicata una tassa di elaborazione di 15 euro.

Articolo situato in e spedito da: Riedlingen, Germania


1.424,00 EUR *
Contenuto 1
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* IVA Excl. escl. Costi di spedizione

The predecessor of this article is TE0808-05-9GI81-A. All changes are in the Product Change Notification (PCN).

Note: Due to the new revision the height profile of the module has changed.
Using TE0808-05 board as a replacement or in system(s) designed for TE0808-04, a review and adaption of mechanics e.g. cooling solutions must be implemented.
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This module will not be discontinued, but we recommend the TE0818 module series with an improved connector for new projects.

The Trenz Electronic TE0808-05-9GI81-E is a MPSoC module integrating a AMD Zynq™ UltraScale+™ ZU9EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC / FPGA
    • Device: AMD Zynq™ UltraScale+™ XCZU9EG-2FFVC900I
    • Speedgrade: -2
    • Temperature range: Industrial
    • Package: FFVC900
    • Grafikprozessor-Unit (GPU)
  • RAM / Storage
    • 4 GByte DDR4 SDRAM
    • 128 MByte SPI Boot Flash (dual parallel)
    • 2 Kbit serial EEPROM with EUI-48 Node Identity
  • On Board
    • Oscillator
  • Interface
    • 4 x 160 pin B2B connectors (ST5)
      • 204 PL IO
        • HP: 156
        • HD: 48
      • 65 PS MIO

      • 4 PS GTR
      • 16 PL GTH
      • I2C, JTAG, CONFIG
    • 2 Transceiver clocks
    • PLL Clock Generator
    • LP, FP, PL separately controlled power domains
  • Power
    • 3.3 V power supply via B2B Connector needed
  • Dimension
    • 5.2 x 7.6 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0808-05-9GI81-E Trenz Electronic MPSoC module with AMD/Xilinx Zynq™ UltraScale+™ ZU9EG

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

ID articolo 102664
Condizione
ID della variazione 3942
Modello TE0808-05-9GI81-E
Produttore Trenz Electronic GmbH
Paese di produzione
Contenuto 1 undefined
Peso 72 g
Peso netto 72 g