Trenz Electronic GmbH

MPSoC Module with AMD Zynq UltraScale+ ZU7EV-1I, 4 GByte DDR4, 5,2 x 7,6 cm (TE0807-03-7DI24-A)

AMD/Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I, 4 GByte DDR4 SDRAM, SPI Flash 512 MByte, 5.2 x 7.6 cm form factor


Numero di variazione (MEPA): VAR-827003102

Codice produttore: TE0807-03-7DI24-A

Codice doganale:


Disponibile per la spedizione immediata: ${ $store.getters.currentItemVariation.stock.net }

Tempo di elaborazione 3 giorni. Per gli ordini con un valore netto totale inferiore a 70 euro, verrà applicata una tassa di elaborazione di 15 euro.

Articolo situato in e spedito da: Riedlingen, Germania


1.360,24 EUR *
Contenuto 1
Effettua il login e ottieni prezzi migliori. Oppure contattateci e richiedete lo stato B2B..

* IVA Excl. escl. Costi di spedizione

The predecessor of this article is TE0807-02-7DI24-A. All changes are in the Product Change Notification (PCN).

This module will not be discontinued, but we recommend the TE0817 module series with an improved connector for new projects.

The Trenz Electronic TE0807-03-7DI24-A is a powerful MPSoC module integrating a AMD Zynq™ UltraScale+™ ZU7EV, 4 GByte DDR4 SDRAM, 512 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • AMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900I
  • ZU7EV 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte DDR4 SDRAM
  • 512 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND)
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado ML Standard Edition (free version)

The Vivado ML Standard Edition is the FREE version of the Vivado design suite. Vivado ML Standard delivers instant access to some basic Vivado features and functionality at no cost.

Overview of all editions of Vivado ML

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0807-03-7DI24-A Trenz Electronic MPSoC Module with AMD Zynq™ UltraScale+™ ZU07EV

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

ID articolo 102650
Condizione
ID della variazione 3929
Modello TE0807-03-7DI24-A
Produttore Trenz Electronic GmbH
Paese di produzione
Contenuto 1 undefined
Peso 70 g
Peso netto 70 g