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Trenz Electronic GmbH
Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05(33013)
Please check assembly instructions! Heat dissipations Chipset Heat Sink with Clip for the modules TE0741-04 and 05
Item number VAR-827002597
Manufacturer Product Number: 33013
Taric/custom code: 84718090
Available for immediate dispatch:more than 100
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 15 euros.
Item located in and dispatched from: Riedlingen, Germany
EUR 15.99
*
Content
1 piece
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* Excl. VAT excl. Shipping
Item ID | 102198 |
Condition | New |
Legacy item ID | 3789 |
Model | 33013 |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 18 g |
Net weight | 18 g |
Customs tariff number | 84718090 |
Solderless Breadboard Kit: Small Solderless Breadboard with Two Power Rails(340-038 )
EUR 7.76 *
* Excl. VAT
excl.
Shipping
UltraSOM+ MPSoC Module with AMD Zynq UltraScale+ ZU9EG-1E, 4 GByte DDR4 (TE0808-05-9BE21-E)
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EUR 776.53 *
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EUR 7.76 *
* Excl. VAT
excl.
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EUR 776.53 *
* Excl. VAT
excl.
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Solderless Breadboard Kit: Small Solderless Breadboard with Two Power Rails(340-038 )
EUR 7.76 *
* Excl. VAT
excl.
Shipping
UltraSOM+ MPSoC Module with AMD Zynq UltraScale+ ZU9EG-1E, 4 GByte DDR4 (TE0808-05-9BE21-E)
EUR 776.53 *
* Excl. VAT
excl.
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Solderless Breadboard Kit: Small Solderless Breadboard with Two Power Rails(340-038 )
EUR 7.76 *
* Excl. VAT
excl.
Shipping
UltraSOM+ MPSoC Module with AMD Zynq UltraScale+ ZU9EG-1E, 4 GByte DDR4 (TE0808-05-9BE21-E)
EUR 776.53 *
* Excl. VAT
excl.
Shipping