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Trenz Electronic
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)

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Trenz Electronic GmbH

BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)

High Performance maxiFLOW/superGRIP Heat Sink BGA Aluminum, Top Mount

Item number VAR-827001460

Manufacturer Product Number: ATS-X50170P-C1-R0

Taric/custom code: 84715000

Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }

Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 15 euros.

Item located in and dispatched from: Riedlingen, Germany

EUR 32.00 ^*

Content 1 piece

Log in and get better prices. Or contact us and request B2B status.

* Excl. VAT excl. Shipping

Item ID	101238
Condition	New
Legacy item ID	3432
Model	ATS-X50170P-C1-R0
Manufacturer	Trenz Electronic GmbH
Manufacturing country	Germany
Content	1 piece
Weight	800 g
Net weight	800 g
Customs tariff number	84715000

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EUR 189.00 *

* Excl. VAT excl. Shipping

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EUR 30.44 *

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EUR 432.68 *

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* Excl. VAT excl. Shipping

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* Excl. VAT excl. Shipping

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* Excl. VAT excl. Shipping

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EUR 88.71 *

* Excl. VAT excl. Shipping

FPGA Module with AMD Artix 7A100T-2I, 2 x 50 Pin-Header, 3.5 x 7.3 cm (TE0725-04-72I-1-B)

EUR 189.00 *

* Excl. VAT excl. Shipping

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* Excluded VAT excluded Shipping cost

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