Product Description
The AXU2CGB-E/3EGB/4EVB-E/5EVB-E development board equipped with the AMD/Xilinx Zynq UltraScale+ MPSoC-series device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, DP, M.2, USB 3.0, CAN, RS485, MIPI, UART.
Provide high-speed storage (M.2) and video applications (DP).
Applications
● Artificial Intelligence
● Automotive
● AV Broadcasting
● Deep learning
● Digital Signal Processing
● 5G Wireless and Wire Communication
● Data Centers
● Drive / Motion Control
● Industrial Internet of Thing
● Cloud Computing Security
● Machine Vision
● Medical Endoscop
● Video and Image Processing
Key Features
System-on-Module
● AMD/Xilinx Zynq Ultrascale+ MPSoC:
◆ ARM quad-core Cortex-A53 up to 1.3 GHz
◆ ARM dual-core Cortex-R5 up to 533 MHz
◆ Mali-400MP2 GPU (only for ZU3EG/ZU4EV/ZU5EV)
◆ H.264 / H.265 Video Codec (only for ZU4EV/ZU5EV)
◆ 16nm FinFET+ FPGA fabric
● Pluggable module with 4 x Panasonic board-to-board connectors
● 4 GByte (64-bit) DDR4 SDRAM on PS (ZU2CG is 2 GByte)
● 1 GByte (16-bit) DDR4 SDRAM on PL (only for ZU3EG/ZU4EV/ZU5EV)
● 32 MB QSPI Flash
● 8 GB eMMC FlashBase Board
● 1 x M.2 Card slot on PS
● 1 x DP Interface on PS
● 1 x 2 lane MIPI on PL
● 2 x CAN on ps
● 2 x RS485 on PL
● 2 x USB3.0 on PS + 2 x USB2.0 on PS
● EEPROM: 4-Kbit I2C Serial EEPROM + 1 x Temperature sensor (LM75)
● 2 x Gigabit Ethernet (1 x PS + 1 x PL)
● 2 x UART (1 x PS + 1 x PL) (USB to UART)
● 1 x Micro SD
● 1 x RTC (Real-time clock)
● 2 x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.)
● LED (1 x pwr + 1 x PL + 1 x PS) + KEY (1 x RST + 1 x PS + 1 x PL)
● 12V single supply
● Dimensions: 160 x 100 mm form factor
Development Board Features
Featuring the AMD/Xilinx's Zynq UltraScale+ MPSoC XCZU3EG-1SFVC784I Adaptive SoC
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq UltraScale+ MPSoC based application.
* The AXU3EGB development board consists of a ACU3EG SoM and base board. If you want to purchase ACU3EG SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX AMD Xilinx Zynq UltraScale+ MPSoC XCZU3EG development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
| System-on-Module | 1 | Base Board | 1 |
|---|---|---|---|
| Heatsink Kit (preinstalled) | 1 | USB Downloader Cable / set | 1 |
| 12V Power Adapter | 1 | Acrylic board | 1 |
| Mini USB Cable | 1 | Card Reader | 1 |
| TF Card | 1 |
Product Matrix
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.
We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.
